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ISSN Online: 2377-424X

ISBN CD: 1-56700-226-9

ISBN Online: 1-56700-225-0

International Heat Transfer Conference 13
August, 13-18, 2006, Sydney, Australia

THREE-DIMENSIONAL MULTI-PHYSICS ANALYSIS OF THE THERMOELECTRIC MICRO-COOLER

Get access (open in a dialog) DOI: 10.1615/IHTC13.p14.160
10 pages

摘要

Three-dimensional multi-physics analysis using the COMSOL software package has been carried out to investigate the thermal and structural characteristics of the thermoelectric micro-cooler. A micro-size and column-type thermoelectric cooler is considered and Bi2Te3 and Sb2Te3 are selected as the n- and p-type thermoelectric materials, respectively. The thickness of the thermoelectric element is several μm but and the thickness of the substrate reaches several hundred μm. The mechanical properties of Sb2Te3 and Bi2Te3 bulk and film are measured by nano-indentation testing method while the thermoelectric properties are obtained from existing literature. The temperature and the stress distribution in the n and p elements of the micro thermoelectric module as well as in the metal connector are obtained. The COP has the maximum value at a certain current and the value decreases with the temperature difference or the thickness. The predicted results also show that the performance can be improved for thick thermoelectric element at the small temperature difference and small current. The maximum stress in the module occurs at the bonding part between the metal connector and thermoelectric elements.