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International Heat Transfer Conference 12

ISSN: 2377-424X (online)
ISSN: 2377-4371 (flashdrive)

Thermal analysis of plate type heat spreader for bare chip cooling

Toshio Tomimura
Institute of Advanced Material Study, Kyushu University, Kasuga, Fukuoka 816-8580, Japan

DOI: 10.1615/IHTC12.800
6 pages

Abstract

In this study, concerning a heat spreader plate with high thermal conductivity for bare chip cooling, numerical analysis using a two-dimensional cylindrical model has been conducted for a series of key parameters. The analysis deals with a steady state heat conduction problem for the four and two layered circular plates systems, which correspond to the simplified models of the present [chip]-[thermal interface material A]-[heat spreader]-[thermal interface material B] system, and the [chip]-[thermal interface material] system without a heat spreader for comparison. Here, a localized heat source with uniform heat flux is flush mounted on the bottom surface of the chip, and the top surface of the chip (two-layer system) or the heat spreader (four-layer system) is in contact with a heat sink with uniform temperature through the thermal interface material. From a series of numerical calculations, the effects of the thickness and the thermal conductivity of the heat spreader and the thermal interface materials A and B, and size of the localized heat source and the chip on the maximum chip temperature are clarified specifically, and the interesting features and mechanisms of the heat spreader and the thermal interface materials are also shown.

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