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ISSN Online: 2377-424X

International Heat Transfer Conference 12
August, 18-23, 2002, Grenoble, France

Transport Phenomena and Microelectromechanical Systems (MEMS)

Get access (open in a dialog) DOI: 10.1615/IHTC12.3350
12 pages

Abstract

MEMS devices with their nano-scale sensing and actuating capabilities provide thermal engineers with an opportunity to design and manufacture many innovative microsystems. For MEMS devices, thermal management and thermo-mechanical design are critical to device reliability. In addition, different thermal actuation schemes are widely used. Examples are thermal actuation, bubble actuation, thermo-mechanical actuation and solder and other surface tension-driven assembly techniques. For thermal/fluid systems using MEMS, the large number of micro-devices enable us to consider a closed-loop control through disturbances generated by micro-flaps or -droplets. Transport phenomena are critical to the advancement of MEMS. Similarly, MEMS devices can be applied to create new thermal/fluid systems.