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Boiling Heat Transfer Characteristics of Simulated Microelectronic Chips with Detachable Heat Sinks

K.-A. Park
Heat Transfer Laboratory Department of Mechanical Engineering Iowa State University Ames, IA 50011, U.S.A.

Arthur E. Bergles
Department of Mechanical, Aerospace, and Nuclear Engineering, Rensselaer Polytechnic Institute, Troy, New York; University of Maryland, College Park, Maryland; Massachusetts Institute of Technology, Cambridge, Massachusetts, USA

Abstract

Microelectronic chips were simulated with thin foil strips direct-electrically heated with a heat transfer area about 5 mm × 5 mm. Various heat sinks were prepared and attached with epoxy adhesive. The basic heat sink configuration was a 5 mm × 5 mm × 1 mm copper plate with holes drilled parallel to the surface or fins cut into the surface. Additional heat sinks were fabricated from two commercial structured surfaces, Linde High Flux and Hitachi Thermoexcel-E. Pool boiling experiments were carried out with Freon-TF (R-113).
The best performance of the plate-type heat sinks was obtained with 0.71 mm diameter "microholes" and 0.49 mm fin gap "microfins" oriented vertically. The High Flux surface provided the best performance overall with ten times the heat flux of the flush heater at a high wall superheat.

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