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Home Archives Thermal Letter Officers Future meetings Assembly for International Heat Transfer Conferences

ISBN : 0-89116-909-1

International Heat Transfer Conference 9
1990, 19-24 August, Jerusalem, Israel

Cooling Of Electronic Equipment

Table of Contents:

THE INFLUENCE OF SUBCOOLING ON THE POOL NUCLEATE BOILING AND CRITICAL HEAT FLUX OF SIMULATED ELECTRONIC CHIPS R. D. M. Carvalho , Arthur E. Bergles pages 289-294 DOI: 10.1615/IHTC9.450
THERMAL MANAGEMENT OF HIGH-POWER TAB 1С CHIPS INCORPORATING HEAT SPREADERS AND HEAT PIPES Shun-lung Chao pages 295-300 DOI: 10.1615/IHTC9.460
COOLING OF ELECTRONIC CHIPS IN LIQUID NITROGEN Kemal Tuzla, A. F. Cokmez-Tuzla, T. J. Crowley , John C. Chen pages 301-306 DOI: 10.1615/IHTC9.470
OPTIMISATION OF FORCED CONVECTION COOLED ELECTRONIC SYSTEMS: AN EXPERIMENTAL STUDY C.J.M. Lasance pages 307-312 DOI: 10.1615/IHTC9.480
AN ALTERNATIVE METHODOLOGY FOR COMPUTING THE TEMPERATURE RISE OF AN ELECTRONIC DEVICE INSIDE A DIRECT AIR-COOLED ELECTRONIC CABINET S. Witzman, D. Newport , T. Nicoletta pages 313-318 DOI: 10.1615/IHTC9.490
APPROXIMATE THERMAL PACKAGING LIMIT FOR HYBRID SUPERCONDUCTOR-SEMICONDUCTOR ELECTRONIC CIRCUITS Markus I. Flik, Kunio Hijikata pages 319-324 DOI: 10.1615/IHTC9.500
STABILITY ANALYSIS OF FORCED-FLOW COOLED SUPERCONDUCTOR Takehiro Ito, Yasuyuki Takata, Daisaku Kasao, Masahiro Kobayashi, Masayuki Ueda pages 325-330 DOI: 10.1615/IHTC9.510
TURBULENT THREE-DIMENSIONAL HEAT TRANSFER ANALYSIS OF ARRAYS OF HEATED BLOCKS Mohammed Faghri, yutaka Asako pages 331-336 DOI: 10.1615/IHTC9.520
EXPERIMENTS ON BOILING INCIPIENCE WITH A HIGHLY-WETTING DIELECTRIC FLUID; EFFECTS OF PRESSURE, SUBCOOLING AND DISSOLVED GAS CONTENT S. M. You, Terrence W. Simon, Avram Bar-Cohen pages 337-342 DOI: 10.1615/IHTC9.530
NATURAL CONVECTION COOLING OF AN ELECTRONIC COMPONENT IN A SLOT Masud Behnia, Graham de Vahl Davis pages 343-348 DOI: 10.1615/IHTC9.540
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