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International Heat Transfer Conference 9

ISSN: 2377-424X (online)
ISSN: 2377-4371 (flashdrive)

EXPERIMENTAL AND NUMERICAL INVESTIGATIONS OF HEAT TRANSFER IN ENCLOSURES CONTAINING HEAT DISSIPATING PLATES

Francois Penot
L.E.S.T.E.(associated with C.N.R.S.) 40, Avenue du Recteur Pineau, 86022 POITIERS Cedex, FRANCE

V. Pimont
CISI INGENIERIE 57, Rue Piere Semard 38000 GRENOBLE, FRANCE

A. Rifi
L.E.S.T.E. 40, Ave du Recteur Pineau 86022 POITIERS, FRANCE

A. Viault
CISI INGENIERIE 57, Rue Piere Semard 38000 GRENOBLE, FRANCE

M. Cadre
C.N.E.T. Route de Tregastel 22301 LANNION, FRANCE

DOI: 10.1615/IHTC9.590
pages 139-143

Abstract

A development program has been elaborated to create an accurate method for predicting air flow and temperature field in electronic systems made of vertical parallel Printed Circuit Boards in an enclosure.

A full 3D model of conjugate heat transfer of an enclosure containing heat dissipating plates is elaborated. An experimental approach is carried out in parallel to validate the flow modelling, and also to evaluate the heat transfer in boundary layers which develop on the different walls of the enclosure.

This evaluation is expected to set up correlations to be used in a reduced model of heat transfer in the enclosure.

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