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Transient Thermal Behavior of The Microprocessor System - Investigation of Effects by Distributed Thermal Capacitance and Thermal Spreading Resistances

DOI: 10.1615/IHTC15.eec.008910
pages 1903-1915

Koji Nishi
AMD Japan Ltd.

Tomoyuki Hatakeyama
Mechanical Systems Engineering, Toyama Prefectural University, 5180 Kurokawa, Imizu, Toyama 939-0398, Japan

Shinji Nakagawa
Toyama Prefectural University; Department of Mechanical Engineering, Aoyama Gakuin University, 6-16-1 Chitosedai, Setagaya, Tokyo 157-8572, Japan

Masaru Ishizuka
Toyama Prefectural University, Kosugi, Toyama 939-0398, Japan

KEY WORDS: Electronic equipment cooling, Thermal management, Transient heat transfer, Thermal network, Thermal capacitance, Thermal spreading resistance


This paper explores transient thermal behavior of the microprocessor system. Thermal control is becoming critical and transient thermal analysis is becoming highly important for system development of portable electronic equipment. Deep understanding about heat transfer paths is critical for accurate temperature prediction. In this paper, three-dimensional heat conduction simulation is conducted for simplified microprocessor system and simulation result is evaluated by dividing each heat transfer path into a series of thermal resistances to see the effect of distributed thermal capacitance and transient thermal spreading resistances. One-dimensional thermal network with material thermal resistances/capacitances, thermal spreading resistances and thermal local resistance is employed to discuss transient thermal resistance and its influence to the hot spot temperature of microprocessor’s silicon die. It is found that some of thermal spreading resistances and heat sink thermal resistance are dominant factors of temperature transient along heat transfer paths and transient behavior of thermal spreading resistance varies by time depending on the ratio of heat transfer rate before and after t=0. On the other hand, distributed thermal capacitance results in changing heat transfer rate by time along heat transfer paths, however, transient material thermal resistances converge relatively rapidly compared to some of thermal spreading resistances.

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