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A Uniform Temperature Heat Sink for Cooling of High Concentrator Photo-Voltaic Systems

DOI: 10.1615/IHTC15.fcv.008418
pages 3239-3249

Albert Mosyak
Faculty of Mechanical Engineering, Technion City, Haifa 32000, Israel

Gad Hetsroni
Department of Mechanical Engineering, Technion- Israel Institute of Technology, Technion City, 32000 Haifa, Israel

Avram Bar-Cohen
Laboratory of the Thermal Management of Electronics, Department of Mechanical Engineering, University of Minnesota, Minneapolis, MN 55455; and Defense Advanced Research Projects Agency (DARPA), Microsystems Technology Office, University of Maryland, College Park, MD


KEY WORDS: Convection, Thermal management, pin fin micro-channel, cooling, concentrator photo-voltaic ?

Abstract

Here we investigate experimentally application of single-phase water in a micro-pin-fin cooler, used for thermal management of a triple-junction solar cell, under concentration of 500 suns. The micro-pin fin heat sink was fabricated of copper using the electric discharge machining (EDM). Silver over nickel plating was applied to the heat sink to allow soldering of the resistor to the heat sink. The heat sink, of 1×1 cm2 , has pin-fins of 0.35×0.35 mm, 1 mm height, on a pitch of 0.45 mm. The dimensions were taken from typical micro-scale devices described in the literature. To minimize the pressure drop, the pin-fins were designed in staggered arrangement, and pin-fin corner was normal to the flow direction. Experiments were performed in the range of heat flux q=5.2-24.7 W/cm2 and mass flux G=10.7-39.1 kg/m2s. A thermal high speed imaging radiometer was utilized to study the temperature field on the electrical heater. We compared temperature non -uniformity (on the heated surface) under conditions of convective heat transfer of water in micro-channel without pin-fins. With pin-fin cooling, the temperature distribution on the whole heater, as recorded by the IR camera, showed that the standard deviation from the average temperature was 0.3-1.9 K and the maximum difference of the wall temperature between different points did not exceed 3-5 K. By cooling at the same conditions using rectangular micro-channel without pin- fins the difference between wall temperature at the inlet and was about 17-28 K, depending on the heat flux the and mass flow rate. This study, to the best of our knowledge, is the first presentation of the method that makes use of a uniform temperature micro- channel single-phase heat sink .

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