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THERMAL SCIENCE AND ENGINEERING - FROM MACRO TO NANO IN 200 YEARS

DOI: 10.1615/IHTC15.fl.000001
pages 559-576

Avram Bar-Cohen
Laboratory of the Thermal Management of Electronics, Department of Mechanical Engineering, University of Minnesota, Minneapolis, MN 55455; and Defense Advanced Research Projects Agency (DARPA), Microsystems Technology Office, University of Maryland, College Park, MD

Caleb A. Holloway
Department of Mechanical Engineering, University of Maryland, College Park, Maryland 20742, USA

Abstract

During the past 200 years thermal science and engineering has experienced a remarkable transformation of scale. Principles and theories that had been established in support of steam engine development and design, at the meter and centimeter scale, are now routinely applied to the design and optimization of nanoelectronic devices, at the micron and nanometer scale. This Fourier Lecture will briefly review the genesis and foundations of the heat transfer discipline and its formative years, continue with a recapitulation of the history of the Assembly for International Heat Transfer Conferences, and then delve into the evolution and "inward migration" of thermal packaging of electronics to illustrate this transformation of scale.

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