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International Heat Transfer Conference 16

ISSN: 2377-424X (online)
ISSN: 2377-4371 (flashdrive)

TUNING THE THERMAL CONDUCTANCE OF POLYMER AND SAPPHIRE INTERFACE

Kun Zheng
Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, P. R. China

Jiaxin Lu
Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, P. R. China

Yafang Zhuang
Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, P. R. China

Fangyuan Sun
Institute of Engineering Thermophysics Chinese Academy of Sciences, Beijing 100049, China

Jie Zhu
Department of Mechanical Engineering, University of Minnesota, Minneapolis, MN 55455, USA; Key Laboratory of Ocean Energy Utilization and Energy Conservation of Ministry of Education, Dalian University of Technology, Dalian, Liaoning 116024, China

Yongmei Ma
Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, P. R. China

Dawei Tang
Key Laboratory of Ocean Energy Utilization and Energy Conservation of Ministry of Education, School of Energy and Power Engineering, Dalian University of Technology, Dalian 116024, China

DOI: 10.1615/IHTC16.cip.023159
pages 2599-2605


KEY WORDS: Nano/Micro scale measurement, Conduction, Interfacial thermal conductance, Adhesion, Solubility parameter

Abstract

Interfacial thermal conductance (ITC) material gains enormous consideration due to its significance in determining thermal performance of hybrid materials, such as polymer based nano-composites. In this study, we test how different parameters affect ITC between polystyrene (PS) and sapphire, including adhesion and solubility parameters. The ITC was measured by time domain thermoreflectance (TDTR) method and the interfacial adhesion between the PS films and the sapphire was measured by a scratch tester. Interfaces with different adhesion were achieved by changing the PS film preparation speed. Self-assembled monolayers (SAM) with various end-groups, which have different solubility, were introduced to interface to bridge PS and sapphire. It was found that the ITC increased with growing interfacial adhesion up to a three-fold. The ITC could be further enhanced by functioning interface with SAMs with varying end groups, such as, -NH2, -Cl, -SH and -H. The thermal conductance of interface modified by SAM (ends with a chloride group) was found to increase up by a factor of seven. This study shows that adhesion and solubility parameter can both affect ITC. However, solubility parameter plays a dominant role in ITC compared with interfacial adhesion. The findings of improvement of the ITC of polymer/ceramic (sapphire) interface can shed some light on the thermal management and reliability of macro- and micro-electronics, where polymeric-hybrid composites are employed.

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