Abo Bibliothek: Guest

ISSN Online: 2377-424X

ISBN Print: 0-89116-559-2

International Heat Transfer Conference 8
August, 17-22, 1986, San Francisco, USA

THE EFFECT OF CONDUCTION DOWN THE WALL ON THE GROWTH OF A TEMPERATURE INTERFACE

Get access (open in a dialog) DOI: 10.1615/IHTC8.340
pages 671-676

Abstrakt

An interface between hot and cold fluids increases in thickness with time by conduction through the fluid but it can also increase by conduction down the walls of the container. The magnitude of this effect has been established by some laboratory experiments with hot and cold water in an insulated glass-wall cylinder. Vertical plates of aluminum and of brass were suspended across the interface and the growth rates measured. It was larger for the aluminum than for the brass and both were much larger than for the glass wall alone. A simple mathematical model was devised based on two bodies with a constant heat transfer coefficient. Numerical solutions of the differential equations showed that the temperature profiles are approximated by error functions. Comparison of these results with the experiments gave similar profiles. However, the heat transfer coefficient in the experiments was very large and could not be predicted accurately. In all cases an approximation based on infinite transfer rate agreed well with measurements.