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International Heat Transfer Conference 16

ISSN: 2377-424X (online)
ISSN: 2377-4371 (flashdrive)

ENHANCED INTERFACIAL HEAT TRANSFER OF LIQUID METAL ALLOY ON COPPER PLATE BY INTRODUCING MO BUFFER LAYER

Huilong Yan
Marine Engineering College, Dalian Maritime University, Dalian, Liaoning 116026 China

Yulong Ji
Marine Engineering College, Dalian Maritime University, Dalian, Liaoning 116026 China

Zongyu Wang
Marine Engineering College, Dalian Maritime University, Dalian, Liaoning 116026 China

Yangbo Deng
Institute of Marine Engineering and Thermal Science, Dalian Maritime University, Dalian, 116026, China

Wenbin Cui
College of Marine Engineering, Dalian Maritime University, Dalian, Liaoning, 116026, China

Guoyou Wang
Marine Engineering College, Dalian Maritime University, Dalian, Liaoning 116026 China

Bohan Tian
Marine Engineering College, Dalian Maritime University, Dalian, 116026, China

Hongbin Ma
Marine Engineering College, Dalian Maritime University, Dalian, Liaoning 116026 China; Department of Mechanical and Aerospace Engineering, University of Missouri, Columbia, Missouri, 65211, USA

DOI: 10.1615/IHTC16.hte.023704
pages 5349-5356


SCHLÜSSELWÖRTER: Heat transfer enhancement, Conduction, Heat transfer enhancement, Buffer layer, Wettability, Liquid metal alloy, Thermal interface resistance

Abstrakt

Modification of the copper surfaces by coating metals is an effective way to improve the wettability and interface bonding between copper plate and liquid metal alloy (LMA). In current work, a continuous Mo buffer layer was formed on copper surfaces by DC magnetron sputtering. The LMA of Ga62.5In21.5Sn16 was used as thermal interface material (TIM) to sandwich Mo-coated copper plates together. The structure and wettability of Mo-coated plate were characterized by X-ray diffractometer and Drop shape analyzer. The peaks of Mo and Cu are observed in the XRD pattern, no other compounds are detected. The contact angles of water on copper plate and Mo-coated copper plate are 65.9° and 17.8° respectively, which shows that the wettability of the Mo-coated copper plate is better than the copper plate. Samples were fabricated to test the effects of the LMA and Mo layer on the thermal properties. The thermal contact resistance of sample Cu-Cu is 937.095 mm2K/W with a thermal conductivity of 3.596 W/mK. The thermal contact resistance of sample Cu-LMA-Cu is 1.119 mm2K/W with a thermal conductivity of 350.356 W/mK. The sample with Mo layer exhibits thermal contact resistance as low as 0.616 mm2K/W with a thermal conductivity of 369.484 W/mK. After wettability modification by coating Mo layer, the thermal contact resistance decreases by about 45%. This indicates that Mo buffer layer plays a critical role in enhancing the thermal transfer at LMA/Cu interface region.

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