Abo Bibliothek: Guest

ISSN Online: 2377-424X

ISBN Print: 978-1-56700-474-8

ISBN Online: 978-1-56700-473-1

International Heat Transfer Conference 16
August, 10-15, 2018, Beijing, China

THERMAL TRANSPORT SIMULATIONS AT CARBON NANOTUBE INTERFACE JUNCTIONS BY MOLECULAR DYNAMICS

Get access (open in a dialog) DOI: 10.1615/IHTC16.cip.022121
pages 2519-2525

Abstrakt

The interfacial thermal transport at stacked carbon nanotube (CNT) junctions are investigated by classical molecular dynamics (MD) simulations. In this work, the thermal conductance (G) between CNTs is improved by various approaches and the effects of crossing angle, contact area, bonding strength, external force and hydrocarbon functionalization on G are investigated. The thermal conductance is improved significantly by connecting two CNTs with hydrocarbon chain linkers CH2. The calculated thermal conductance G increases from 229 pW/K without linkers to 4901 pW/K with an optimized linker number, which increases by a factor of 20. Meanwhile, it is found that the thermal conductance G increases monotonically with contact area but decreases inversely with crossing angle. The van der Waals (vdW) bonding strength and applied external force have similar effects on thermal conductance, and facilitate the interfacial thermal transport by improving the contact pressures. Synthesized relationship of internal coupling strength, external force and final separation distance between CNTs is analyzed to illustrate the variation of thermal conductance and intermolecular potential energy.