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International Heat Transfer Conference 16

ISSN: 2377-424X (online)
ISSN: 2377-4371 (flashdrive)


Yuanchen Hu
Georgia Institute of Technology, 801 Ferst Drive, Atlanta, GA 30332, USA

Lu Wang
Beijing Institute of Technology, No.5 Zhongguancun St. Haidian District, Beijing 100081, China

DOI: 10.1615/IHTC16.ctm.023708
pages 4021-4028

SCHLÜSSELWÖRTER: Thermal management, Electronic equipment cooling, Hotspot, Bibliometrics


"Internet of Everything (IOE)", connecting human to everyone and everything via the internet through intelligent mobile devices, is deeply changing our lifestyle. Accompanying this revolution, much attention has been drawn to address the hot spots thermal management with an increasing demand for high-performance electronics; hence, this bibliometric review is timely. We assess the global scientific research on the hot spots thermal management both quantitatively and qualitatively, based on the Science Citation Index Expanded and the Institute of Electrical and Electronics Engineers spanning a quarter century and 1,443 publications. Our analysis illustrates the role of collaborative efforts in successful scientific research on hot spots thermal management. The United States has contributed most to the literature on the hotspot thermal management with 695 publications (47.6% of total publication worldwide), the highest h-index (42), all of the 10 most cited articles, and 9 of 10 the most productive institutions. China has the second most publications, which are rapidly increasing since 2012, and the gap with U.S. in terms of productivity for the first time was narrowed to 40 percent since 2016. Tsinghua University from China is the only one outside U.S. in the top-ten list. Based on the content analysis of author keywords, we discover that half of the most cited papers focus on electric engineering devices, four on nano-scale material technologies, and the rest one on data-centers. 3D-IC cooling is calling for more attention in the recent decade, as these three widely-used keywords indicate the trend of hotspot thermal management.

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