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International Heat Transfer Conference 8

ISSN: 2377-424X (online)
ISSN: 2377-4371 (flashdrive)


Richard C. Chu
Mid-Hudson Valley Laboratory, Enterprise Systems, IBM Corporation, Poughkeepsie, NY, USA

DOI: 10.1615/IHTC8.2500
pages 293-305


This paper provides an overview and assessment of the most recent developments in heat transfer and thermal packaging as applied to electronics systems. Examples of current large scale computer cooling applications are given, and possible future applications are discussed. Input is drawn from both recent publications of heat transfer practitioners in the electronics industry and university researchers.

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