Suscripción a Biblioteca: Guest
Inicio Archivos Thermal Letter Funcionarios Reuniones futuras Assembly for International Heat Transfer Conferences
International Heat Transfer Conference 8

ISSN: 2377-424X (online)
ISSN: 2377-4371 (flashdrive)

HEAT TRANSFER IN ELECTRONIC SYSTEMS

Richard C. Chu
Mid-Hudson Valley Laboratory, Enterprise Systems, IBM Corporation, Poughkeepsie, NY, USA

DOI: 10.1615/IHTC8.2500
pages 293-305

Sinopsis

This paper provides an overview and assessment of the most recent developments in heat transfer and thermal packaging as applied to electronics systems. Examples of current large scale computer cooling applications are given, and possible future applications are discussed. Input is drawn from both recent publications of heat transfer practitioners in the electronics industry and university researchers.

Comprar $25.00 Check subscription Éticas y mala práctica de publicación Recomendado para Mi Bibliotecario Marcar esta Página como Favoritos