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ISSN Online: 2377-424X

ISBN Print: 0-89116-909-1

International Heat Transfer Conference 9
August, 19-24, 1990 , Jerusalem, Israel

AN ALTERNATIVE METHODOLOGY FOR COMPUTING THE TEMPERATURE RISE OF AN ELECTRONIC DEVICE INSIDE A DIRECT AIR-COOLED ELECTRONIC CABINET

Get access (open in a dialog) DOI: 10.1615/IHTC9.490
pages 313-318

Sinopsis

The paper presents a methodology for creating a semi-analytical equation that correlates the temperature rise in the thermal boundary layer around an electronic device inside a direct air-cooled cabinet. The prime assumption for creating this model is that the heat transfer from a device to the air flow is determined by the local flow conditions, independent of the global flow conditions of the entire channel.
The result is an expression that directly correlates the temperature rise of an electronic device to the geometric characteristics of the card and cabinet. In contrast with the results from other computational methodologies that can be used for temperature prediction only, this equation allows for the direct prediction of the optimum mechanical dimensions when thermal requirements are imposed on the system.