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ISSN Online: 2377-424X

ISBN Print: 978-1-56700-474-8

ISBN Online: 978-1-56700-473-1

International Heat Transfer Conference 16
August, 10-15, 2018, Beijing, China

NUMERICAL SIMULATION OF HEAT TRANSFER CHARACTERISTIC OF DOUBLE-LAYER Y-SHAPED MICROCHANNEL HEAT SINK

Get access (open in a dialog) DOI: 10.1615/IHTC16.cov.024183
pages 3425-3432

Sinopsis

With the reduction of the computer space, electronic chips are bound to endure higher heat fluxes. While double-layer microchannel heat sink compared with single-layer microchannel heat sink can improve the temperature uniformity of electric-chip significantly. The traditional air-cooling methods cannot satisfy the requirement of excessive thermal loads above 25w/mm2. Therefore, a double-layer Y-shaped bifurcation water-cooling microchannel was designed for cooling the heat sink. The pressure drop and the laminar heat transfer performance of double-layer Y-shaped bifurcation have been discussed numerically. Results reveal that with the same convective surface area, the Y-shaped bifurcation can improve the heat transfer performance of the heat sink and decrease the pressure drop through the microchannel at the same pumping power. Moreover, the geometry parameters of Y-shaped double-layer microchannel are optimized to improve the thermal performance of heat sink, including bifurcation angle and the bifurcation number. The bifurcation angle is 60 and the bifurcation number is 2.