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ISSN Online: 2377-424X

ISBN Print: 0-89116-909-1

International Heat Transfer Conference 9
August, 19-24, 1990 , Jerusalem, Israel

THE INFLUENCE OF SUBCOOLING ON THE POOL NUCLEATE BOILING AND CRITICAL HEAT FLUX OF SIMULATED ELECTRONIC CHIPS

Get access (open in a dialog) DOI: 10.1615/IHTC9.450
pages 289-294

Résumé

Three commercially available enhanced boiling surfaces (Union Carbide High Flux, Hitachi Thermoexcel−E, and Wieland GEWA−T) and a smooth copper surface were used to reduce the wall superheat and increase the critical heat flux (CHF) of 5mm × 5mm simulated electronic chips. Experiments were performed in a pool of FC−72 at atmospheric pressure under saturated and sub-cooled conditions; the subcooling range was 0−31° C. It was found that particular combinations of enhanced surface and subcooling can provide the heat removal capability required for future high flux chips. Heat fluxes higher than 106W/m2 were obtained. Insight into the influence of subcooling on pool nucleate boiling and CHF is gained.