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International Heat Transfer Conference 9

ISSN: 2377-424X (online)
ISSN: 2377-4371 (flashdrive)

Cooling Of Electronic Equipment

Table des matières

THE INFLUENCE OF SUBCOOLING ON THE POOL NUCLEATE BOILING AND CRITICAL HEAT FLUX OF SIMULATED ELECTRONIC CHIPS
R. D. M. Carvalho , Arthur E. Bergles
pages 289-294
DOI: 10.1615/IHTC9.450
$25.00
THERMAL MANAGEMENT OF HIGH-POWER TAB 1С CHIPS INCORPORATING HEAT SPREADERS AND HEAT PIPES
Shun-lung Chao
pages 295-300
DOI: 10.1615/IHTC9.460
$25.00
COOLING OF ELECTRONIC CHIPS IN LIQUID NITROGEN
Kemal Tuzla, A. F. Cokmez-Tuzla, T. J. Crowley , John C. Chen
pages 301-306
DOI: 10.1615/IHTC9.470
$25.00
OPTIMISATION OF FORCED CONVECTION COOLED ELECTRONIC SYSTEMS: AN EXPERIMENTAL STUDY
C.J.M. Lasance
pages 307-312
DOI: 10.1615/IHTC9.480
$25.00
AN ALTERNATIVE METHODOLOGY FOR COMPUTING THE TEMPERATURE RISE OF AN ELECTRONIC DEVICE INSIDE A DIRECT AIR-COOLED ELECTRONIC CABINET
S. Witzman, D. Newport , T. Nicoletta
pages 313-318
DOI: 10.1615/IHTC9.490
$25.00
APPROXIMATE THERMAL PACKAGING LIMIT FOR HYBRID SUPERCONDUCTOR-SEMICONDUCTOR ELECTRONIC CIRCUITS
Markus I. Flik, Kunio Hijikata
pages 319-324
DOI: 10.1615/IHTC9.500
$25.00
STABILITY ANALYSIS OF FORCED-FLOW COOLED SUPERCONDUCTOR
Takehiro Ito, Yasuyuki Takata, Daisaku Kasao, Masahiro Kobayashi, Masayuki Ueda
pages 325-330
DOI: 10.1615/IHTC9.510
$25.00
TURBULENT THREE-DIMENSIONAL HEAT TRANSFER ANALYSIS OF ARRAYS OF HEATED BLOCKS
Mohammed Faghri, Yutaka Asako
pages 331-336
DOI: 10.1615/IHTC9.520
$25.00
EXPERIMENTS ON BOILING INCIPIENCE WITH A HIGHLY-WETTING DIELECTRIC FLUID; EFFECTS OF PRESSURE, SUBCOOLING AND DISSOLVED GAS CONTENT
S. M. You, Terrence W. Simon, Avram Bar-Cohen
pages 337-342
DOI: 10.1615/IHTC9.530
$25.00
NATURAL CONVECTION COOLING OF AN ELECTRONIC COMPONENT IN A SLOT
Masud Behnia, Graham de Vahl Davis
pages 343-348
DOI: 10.1615/IHTC9.540
$25.00