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ISSN Online: 2377-424X

ISBN Print: 978-1-56700-421-2

International Heat Transfer Conference 15
August, 10-15, 2014, Kyoto, Japan

Transient Thermal Behavior of The Microprocessor System - Investigation of Effects by Distributed Thermal Capacitance and Thermal Spreading Resistances

Get access (open in a dialog) DOI: 10.1615/IHTC15.eec.008910
pages 1903-1915

Résumé

This paper explores transient thermal behavior of the microprocessor system. Thermal control is becoming critical and transient thermal analysis is becoming highly important for system development of portable electronic equipment. Deep understanding about heat transfer paths is critical for accurate temperature prediction. In this paper, three-dimensional heat conduction simulation is conducted for simplified microprocessor system and simulation result is evaluated by dividing each heat transfer path into a series of thermal resistances to see the effect of distributed thermal capacitance and transient thermal spreading resistances. One-dimensional thermal network with material thermal resistances/capacitances, thermal spreading resistances and thermal local resistance is employed to discuss transient thermal resistance and its influence to the hot spot temperature of microprocessor’s silicon die. It is found that some of thermal spreading resistances and heat sink thermal resistance are dominant factors of temperature transient along heat transfer paths and transient behavior of thermal spreading resistance varies by time depending on the ratio of heat transfer rate before and after t=0. On the other hand, distributed thermal capacitance results in changing heat transfer rate by time along heat transfer paths, however, transient material thermal resistances converge relatively rapidly compared to some of thermal spreading resistances.