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ISSN Online: 2377-424X

International Heat Transfer Conference 12
August, 18-23, 2002, Grenoble, France

Thermal constriction phenomena in reversing heat flow systems

Get access (open in a dialog) DOI: 10.1615/IHTC12.380
6 pages

要約

Thermal constriction phenomena play an essential rôle on temperature distributions and behaviour of complex systems such as ultra-compact electronic circuits. The thermal constriction has been studied under various shapes and boundary conditions by many authors. In this paper, we investigate a novel configuration of the thermal constriction, corresponding to a reversing of the heat flow. The system under consideration is an heat source and an heat sink placed on one of the plane surfaces of a finite insulated cylindrical tube. Investigations have been performed in view to design electronic power systems, more especially for the integration of chips and components on Multi-Chip modules. The paper reports the following points : a description and a presentation of the method set up to solve heat conduction problem and provide the reversal thermal resistance of the system, a sensitivity analysis of the convergence of the solution, as well as the method used for the inversion of the linear system, a validation and a comparison of the solution with the one given by finite element method. The last point presented is a thermal analysis of the reversing heat flow phenomena and a comparison between the reversal thermal resistance and a traditional resistance, corresponding at two possible implantations of a component.