ISSN Online: 2377-424X
ISBN Print: 0-89116-909-1
International Heat Transfer Conference 9
EVALUATION OF THERMAL ENHANCEMENT FILMS FOR ELECTRONIC PACKAGES
要約
Experimental results are presented for several new materials developed to enhance the thermal contact conductance in electronic systems and devices. The materials evaluated include a polyimide film coated with a paraffin-based compound, an aluminum foil with the same coating, a polyimide film embedded with commercial grade diamonds and coated with copper, an uncoated polyimide film embedded with commercial grade diamonds, and a plain polyimide film. Tests were conducted in a standard cut-bar apparatus with the specimen located between two Aluminum 6061-T6 test fixtures. Measurements were taken at interface pressures ranging from 200 to 1500 kPa and a constant interface temperature of 25°C. The paraffin-based coated materials increased the thermal contact conductance by a factor of seven to ten times the bare junction, while the diamond embedded films slightly decreased the conductance.