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International Heat Transfer Conference 16

ISSN: 2377-424X (online)
ISSN: 2377-4371 (flashdrive)

ANALYSIS OF THE TWO-LAYERED MINI/MICRO-CHANNEL HEAT SINK BASED ON LIQUID METAL AND WATER

Yujie Ding
Key Laboratory of Cryogenics, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100190, China; School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, China

Sicong Tan
Beijing Key Lab of Cryo-Biomedical Engineering and Key Lab of Cryogenics, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100190, China; School of Future Technology, University of Chinese Academy of Sciences, Beijing 100039, China

Jing Liu
Beijing Key Lab of Cryo-Biomedical Engineering and Key Lab of Cryogenics, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing, 100190, China; School of Future Technology, University of Chinese Academy of Sciences, Beijing, 100039, China; Department of Biomedical Engineering, School of Medicine, Tsinghua University, Beijing, 100084, China

DOI: 10.1615/IHTC16.ctm.022493
pages 3655-3661


キーワード: Electronic equipment cooling, Heat transfer enhancement, micro/mini-channel, heat sink, numerical simulation, liquid metal

要約

In this work, a two layered mini/micro-channel heat sink based on liquid metal and water is proposed. The mini channel for liquid metal and micro channel for water were stacked together to enhance the cooling capability. The thermal performance of current design is analyzed using the three dimensional numerical simulation. The effects of different flow arrangements and heating direction on the thermal performance of the heat sink are studied under different flow rates. The results indicate that the thermal resistance and streamwise temperature rise of the counter flow arrangement with water channel layer attaching the heat source are substantially reduced. In addition, the two layered heat sink based on liquid metal and water has better heat dissipation capacity for its relatively lower thermal resistance and pumping power than the pure liquid metal and water two-layered heat sink.

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