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ISSN Online: 2377-424X

International Heat Transfer Conference 12
August, 18-23, 2002, Grenoble, France

Effect of the size of micro-pin-fin on boiling heat transfer from silicon chips immersed in FC-72

Get access (open in a dialog) DOI: 10.1615/IHTC12.860
6 pages

Resumo

Experiments were conducted to study the effect of the size of micro-pin-fin on boiling heat transfer from a silicon chip immersed in a pool of degassed or gas-dissolved FC-72. Four kinds of micro-pin-fins with the dimensions of 10 × 10 × 60, 20 × 20 × 60, 30 × 30 × 60 and 50 × 50 × 60 µm3 (width × thickness × height) were fabricated on the surface of a square silicon chip with the dimensions of 10 × 10 × 0.5 mm3 by use of the dry etching technique. Experiments were conducted at the liquid subcoolings ΔTsub of 0,3, 25 and 45 K under the atmospheric condition. The results were compared with those for a smooth chip and previously developed enhanced surfaces. The micro-pin-finned chips showed a considerable heat transfer enhancement as compared to a smooth chip in the nucleate boiling region. The boiling curve showed a steep increase in the heat flux with increasing wall superheat. For the micro-pin-finned chips, the critical heat flux was 1.9 to 2.3 times as large as that for the smooth chip and the wall temperature at the critical-heat-flux point was lower than the upper limit for the reliable operation of LSI chips (= 85 °C). While the wall superheat at boiling incipience was strongly dependent on the dissolved gas content, it was little affected by the liquid subcooling.