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ISSN Online: 2377-424X

ISBN Print: 0-89116-559-2

International Heat Transfer Conference 8
August, 17-22, 1986, San Francisco, USA

HEAT TRANSFER IN ELECTRONIC SYSTEMS

Get access (open in a dialog) DOI: 10.1615/IHTC8.2500
pages 293-305

Resumo

This paper provides an overview and assessment of the most recent developments in heat transfer and thermal packaging as applied to electronics systems. Examples of current large scale computer cooling applications are given, and possible future applications are discussed. Input is drawn from both recent publications of heat transfer practitioners in the electronics industry and university researchers.