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ISSN Online: 2377-424X

ISBN Print: 978-1-56700-421-2

International Heat Transfer Conference 15
August, 10-15, 2014, Kyoto, Japan

L-Shaped Thermosyphon Loop with Vertical Evaporator for Power Electronics Cooling

Get access (open in a dialog) DOI: 10.1615/IHTC15.eec.008546
pages 1987-1996

Resumo

A continuous increase in power densities has been observed in the power community over the years. Finding suitable cooling schemes and new approaches is a mandatory step toward efficient and reliable operation of power electronic devices. Two-phase cooling and in particular two-phase thermosyphons have demonstrated the capability of extending the range of applicability of air cooling, providing a valid substitute to standard approaches. The high heat transfer coefficients linked with the evaporation and condensation processes make the low thermal resistances of two-phase based systems really attractive for the power community. A novel two-phase L-shaped thermosyphon with vertical evaporator is presented whereby the heat exchanger is based on automotive technology. The design uses numerous multi-port extruded tubes with capillary sized channels disposed in parallel and brazed to a heated plate. A mutual arrangement of 90° between condenser and evaporator body allows an optimal geometry with limited total volume occupancy. The usage of an automotive condenser type ensures limited air pressure drop, weight and optimal power density when compared to standard heat-sink technology. The thermal performance of this power electronic cooling system is presented with R245fa as working fluid. The influence of several parameters on the performances was studied experimentally including coolant flow rate, coolant temperature, heat load and fluid filling.