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Главная Архив Thermal Letter Оргкомитет Будущие конференции AIHTC
International Heat Transfer Conference 6

ISSN: 2377-424X (online)
ISSN: 2377-4371 (flashdrive)

FULL THERMAL INVESTIGATION OF THE INTEGRATED CIRCUIT μA726

M. C. Bodea
Polytechnic Institute, Bucharest, Romania

A. P. Silard
Polytechnic Institute, Bucharest, Romania

M. A. Luca
Polytechnic Institute, Bucharest, Romania

N. Marinescu
IPRS-Baneasa, Str.Erou Iancu Nicolae nr.32, Bucharest, Romania

DOI: 10.1615/IHTC6.2910
pages 191-195

Аннотация

A full thermal investigation of the Temperature Stabilized Substrate Integrated Circuit (TSS IC) μA726 has been performed using a new and accurate quasi-three dimensional numerical method. This new method allows a reduction of the three-dimensional thermal problem to a bidimensional one. This reduction do not affect the accuracy of the computed temperature distribution of the semiconductor chip. The validity of our approach was checked experimentally. A good agreement was found between theoretical and experimental data. This method, tested in complete and interactive electrical and thermal analysis of TSS IC μA726 is of a general validity, beeing a valuable tool in electrothermal analysis of other integrated circuits(ICS).

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