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Главная Архив Thermal Letter Оргкомитет Будущие конференции AIHTC
International Heat Transfer Conference 9

ISSN: 2377-424X (online)
ISSN: 2377-4371 (flashdrive)

AN ALTERNATIVE METHODOLOGY FOR COMPUTING THE TEMPERATURE RISE OF AN ELECTRONIC DEVICE INSIDE A DIRECT AIR-COOLED ELECTRONIC CABINET

S. Witzman
BNR, Ottawa, Canada

D. Newport
BNR, Ottawa, Canada

T. Nicoletta
BNR, Ottawa, Canada

DOI: 10.1615/IHTC9.490
pages 313-318

Аннотация

The paper presents a methodology for creating a semi-analytical equation that correlates the temperature rise in the thermal boundary layer around an electronic device inside a direct air-cooled cabinet. The prime assumption for creating this model is that the heat transfer from a device to the air flow is determined by the local flow conditions, independent of the global flow conditions of the entire channel.
The result is an expression that directly correlates the temperature rise of an electronic device to the geometric characteristics of the card and cabinet. In contrast with the results from other computational methodologies that can be used for temperature prediction only, this equation allows for the direct prediction of the optimum mechanical dimensions when thermal requirements are imposed on the system.

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