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ISSN Online: 2377-424X

ISBN Print: 978-1-56700-421-2

International Heat Transfer Conference 15
August, 10-15, 2014, Kyoto, Japan

Super-Thin Heat Pipe in Smartphone Application

Get access (open in a dialog) DOI: 10.1615/IHTC15.hpp.009031
pages 3751-3761

Аннотация

In recent years with smartphone innovation, heat pipe was considered as a potential solution to solving its thermal problems. However, the most challenging of using heat pipe in this application is super-thin requirement for heat pipe thickness which must be in sub-millimeter level (0.5-0.8mm) or even thinner. Traditional heat pipe maybe not applicable due to large size, therefore, it is essential to develop new heat pipe which must be not only thinner, but also higher in thermal performance. This paper shows a detail development of super-thin heat pipes, as thin as 0.5mm. In order to improve and characterize the heat pipe thermal performance, various parameters were investigated such as type of wick structures, shapes, sizes and positioning, length and thickness and surface wettability. Maximum heat transfer and thermal resistance for various heat pipe shapes and sizes are presented for super-thin heat pipe thickness ranging from 0.5 to 0.8mm and heat transfer capability ranging from 2W to 15W. This research work demonstrates 0.5mm super-thin heat pipe with center fiber wick structure and presented some embedded heat pipe heat spreader solutions for smartphone. Discussion on the design and thermal performance and application for smartphone cooling solution of these super-thin heat pipes.