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ISSN Online: 2377-424X

ISBN Print: 978-1-56700-474-8

ISBN Online: 978-1-56700-473-1

International Heat Transfer Conference 16
August, 10-15, 2018, Beijing, China

A MIXTURE THEORY BASED ENTHALPY POROSITY MODEL FOR PERFORMANCE STUDY OF NANO ENHANCED PCM HEAT SINK

Get access (open in a dialog) DOI: 10.1615/IHTC16.ctm.024196
pages 4087-4096

Аннотация

Now-a-days, the use of electronic gadgets is becoming the inherent part of the modern lifestyle. For that, every manufacturer is in the search of making portable gadgets. For an electronic gadget to be portable, it should be compact and should have motionless parts. In most of the electronic gadgets, the well-established cooling method is the active cooling which has moving parts. The basic necessity for a compact gadget is that it should be embedded with motionless passive cooling technique. One of the most promising passive cooling techniques involves the use of PCM. The selection of phase change material (PCM) is justified by its inherent high latent heat of fusion per unit volume. To increase the thermal transport capability of PCM, researchers have started using thermal conductivity enhancers like nanoparticles, fins, foam etc. The current study focuses on use of eicosane as PCM mixed with copper nanoparticles. The resulting solution is termed as nanocolloid. A macroscopic one-fluid-mixture approach with the single-domain enthalpy-porosity method is used to model this nanocolloid system. In this study, the effect of the size (5 nm and 20 nm) of the nanoparticles on evolving nanoparticle distribution during melting and solidification is reported. Thermal-solutal convection as well as the Brownian and Thermophoretic effects is taken into account. The study entirely focuses on how the nanoparticles enhance the heat transfer and are distributed during melting and solidification. How the characteristics of nanoparticle distribution affect the thermal transport capability is highlighted. The effect of nanoparticle distribution on PCM melt fraction and heat sink base temperature variation is investigated. Finally, the thermal performance of nano enhanced PCM is compared with pure PCM.