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ISSN Online: 2377-424X

ISBN Print: 0-89116-909-1

International Heat Transfer Conference 9
August, 19-24, 1990 , Jerusalem, Israel

CONVECTTVE HEAT TRANSFER CHARACTERISTICS OF SIMULATED DUAL-IN-LINE PLASTIC CHIPS

Get access (open in a dialog) DOI: 10.1615/IHTC9.2210
pages 365-370

摘要

Dual-in-line plastic chip was simulated with a 16-pin-socket to which stainless steel foil was bonded. Direct-current power was supplied to the socket heater. Eight rows of socket heaters were tested in the channel of the wind tunnel.
Main paths of heat flow were the top surface to air, leads to substrate-air, and directly leads to air. Convective heat transfer of directly leads to air was effective only in the first and second rows. Thermal resistance of leads, which was sum of leads to air and leads to substrate-air, was about twice that of the top surface to air. Heat transfer through leads was mainly occurred by conduction between leads and the substrate, then convection between the substrate and air after the third row. The thermal resistance of leads was larger at the rear row than at the front row. There was very small effect of magnitude of air velocity on the thermal resistance of leads. The effect of gap between the main axes of heaters on heat transfer was very small.