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Home Archives Thermal Letter Officers Future meetings Assembly for International Heat Transfer Conferences
International Heat Transfer Conference 16
2018, 10-15 August, Beijing, China

INVERSE DESIGN OF THERMAL META-DEVICE

Get access DOI: 10.1615/IHTC16.cip.023681
pages 2661-2667

Abstract

Thermal meta-devices owning special thermal regulation and control functions have rapidly developed recently. Researchers have proposed transformation thermodynamics and scattering cancellation to design the material property of the unique thermal meta-device. But in the practice, both methods not only require prior complex detail structure design which significantly affects the ultimate performance of the thermal meta-device, but also pay few attentions to the heat flux inside the meta-device by just taking the boundary conditions as imports of the methods. In this paper, we present a brand-new idea to inversely design the thermal meta-device through primarily providing a series of slopes of peculiar heat flux inside the mete-device, avoiding the detail structure design and adopting the previous thermal performance when the determination of heat flux situations become ahead of the steps of whole study. Here, we deduct the formula for angle of heat flux deflection expressed by anisotropic thermal conductivities. Calculating the derived heat flux slope expressions can easily get responsible deflection angles or curve slopes which then are the imports to finally gain the wanted thermal conductivities of material. This paper presents the crucial methods and detail processes of the inverse design of thermal conductivities. The verification of the formula for angle of heat flux and the comparison of the simulation and the theory of inverse design are simultaneously carried out and appear of significant performance.
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