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ISSN Online: 2377-424X

ISBN Print: 978-1-56700-474-8

ISBN Online: 978-1-56700-473-1

International Heat Transfer Conference 16
August, 10-15, 2018, Beijing, China

OPTIMAL LIQUID COOLING PERFORMANCE OF 2.5D-SICS WITH PIN-FIN ENHANCED MICRO-GAPS USING DESIGN OF EXPERIMENT

Get access (open in a dialog) DOI: 10.1615/IHTC16.ctm.023633
pages 4005-4011

Abstract

In recent years, the demand for powerful mobile devices has risen rapidly because of the large-scale adoption of the internet. The Internet of everything (IoE), connecting humans to everything by internet, is deeply changing our lifestyle. This change requires high-speed and high-quality data transfer within and between mobile devices. 2.5D stacked integrated circuits (2.5D-SICs) with through-silicon vias (TSV), as next generation silicon technologies, are promising to overcome the limitation of system scaling and enable mobile devices with increased functionality. Both high power heterogeneous chips and limited space contribute to the thermal bottleneck of 2.5D-SICs. Microfluidic cooling is a promising approach to overcome this challenge. Previous work demonstrated that pin-fin enhanced micro-gap cooling can address the heat dissipation challenge for 3D-SICs. In this paper, five heat sources, including one field programmable gate array (FPGA) of 25 mm×25 mm, and four transceivers, each 6 mm×6 mm, are adopted in a thermal test vehicle. Non-uniform pin-fin structures for five chips in the micro-gap were systematically optimized by utilizing Design of Experiment (DoE) with full-scale computational fluid dynamics/heat transfer (CFD/HT) simulations. With the guidance of DoE, 15 representative cases with various pin-fin structures have been simulated by CFD/HT. Optimized pin fin structures for five chips have been derived and proposed to save time and cost. These optimized structures of five chips have been verified by CFD/ HT as meeting the target temperatures of the five chips with the lowest pressure drop.