ISSN Online: 2377-424X
ISBN Print: 0-89116-559-2
International Heat Transfer Conference 8
HEAT TRANSFER IN ELECTRONIC SYSTEMS
Sinopsis
This paper provides an overview and assessment of the most recent developments in heat transfer and thermal packaging as applied to electronics systems. Examples of current large scale computer cooling applications are given, and possible future applications are discussed. Input is drawn from both recent publications of heat transfer practitioners in the electronics industry and university researchers.