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ISSN Online: 2377-424X

ISBN Print: 0-89116-909-1

International Heat Transfer Conference 9
August, 19-24, 1990 , Jerusalem, Israel

EVALUATION OF THERMAL ENHANCEMENT FILMS FOR ELECTRONIC PACKAGES

Get access (open in a dialog) DOI: 10.1615/IHTC9.310
pages 445-450

Résumé

Experimental results are presented for several new materials developed to enhance the thermal contact conductance in electronic systems and devices. The materials evaluated include a polyimide film coated with a paraffin-based compound, an aluminum foil with the same coating, a polyimide film embedded with commercial grade diamonds and coated with copper, an uncoated polyimide film embedded with commercial grade diamonds, and a plain polyimide film. Tests were conducted in a standard cut-bar apparatus with the specimen located between two Aluminum 6061-T6 test fixtures. Measurements were taken at interface pressures ranging from 200 to 1500 kPa and a constant interface temperature of 25°C. The paraffin-based coated materials increased the thermal contact conductance by a factor of seven to ten times the bare junction, while the diamond embedded films slightly decreased the conductance.