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ISSN Online: 2377-424X

ISBN Print: 0-89116-909-1

International Heat Transfer Conference 9
August, 19-24, 1990 , Jerusalem, Israel

NATURAL CONVECTION COOLING OF AN ELECTRONIC COMPONENT IN A SLOT

Get access (open in a dialog) DOI: 10.1615/IHTC9.540
pages 343-348

要約

The problem of natural convection cooling of an electronic microchip located in a two-dimensional vertical slot with the top open to the atmosphere and the bottom closed has been considered. The two vertical walls of the slot are of equal thickness and made of the same substrate material. The chip is assumed to be very thin with a constant uniform heat dissipation and is located on the left substrate. The geometry is specified by the height of the slot, the inter-substrate gap, the substrate thickness and the location of the electronic component. The stream function-vorticity formulation of the governing equations is discretized using finite differences. The flow computational domain is restricted to the region within the slot and an ADI solution procedure is adopted. In the solid regions, the computational domain is confined by the vertical adiabatic outer walls and the two-dimensional conduction equation is solved. Results are presented for a slot with a height to width aspect ratio of 5, with the microchip located at the mid-height. Preliminary solutions are obtained for air and Rayleigh numbers of 104 to 106.