ライブラリ登録: Guest

ISSN Online: 2377-424X

ISBN CD: 1-56700-226-9

ISBN Online: 1-56700-225-0

International Heat Transfer Conference 13
August, 13-18, 2006, Sydney, Australia

THERMAL MANAGEMENT OF HIGH-POWER MICROPROCESSOR UNITS USING VAPOR CHAMBER TECHNOLOGY

Get access (open in a dialog) DOI: 10.1615/IHTC13.p18.310
11 pages

要約

This paper describes experimental and numerical analyses on transient and steady-state heat transfer characteristics of a flat-plate type heat pipe called “Vapor Chamber”. The vapor chamber works as a heat spreader to spread the heat from a small heat source to a large heat sink, resulting in a low thermal resistance between them. Experimental results are reported on start-up characteristics, a response to sudden change in heat flux as well as steady-state characteristics of the vapor chamber. A three-dimensional mathematical model is also developed to analyze the transient and steady-state heat transfer characteristics of the vapor chamber. Numerical results are shown, and their close agreement with the experimental results confirms the validity of the present numerical analyses. Furthermore, the heat transfer characteristics of the vapor chamber are compared with those of the conventional metal heat spreaders (aluminum and copper plates). Thermal performance of the vapor chamber is slightly higher than that of the copper plate of the same size, and then the vapor chamber is about 30 % lighter than the copper plate.