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ISSN Online: 2377-424X

ISBN Print: 978-1-56700-474-8

ISBN Online: 978-1-56700-473-1

International Heat Transfer Conference 16
August, 10-15, 2018, Beijing, China

ANALYSIS OF THE THERMAL CHARACTERISTICS AND LIFE TIME OF IGBTS BY VARYING THE THERMAL INTERFACE MATERIAL THICKNESS

Get access (open in a dialog) DOI: 10.1615/IHTC16.ctm.024314
pages 4097-4105

要約

The quality of thermal interface materials (die attach, base-plate solder, thermal grease or pad between the baseplate solder and the sink) play a very important role in the thermal performance and the corresponding lifetime of any IGBT(Insulated Gate Bipolar Transistor) module [1,2]. In this paper both measurement and simulation experiments will be shown using a thermal transient tester and CFD(Computational Fluid Dynamics) simulation environment. The thickness and other key parameters of thermal interface materials used in the heat conduction path will be varied, and we will demonstrate, how these changes affect the lifetime of the component in a given application.
In order to be able to predict the lifetime, the lifetime curves describing the component have to be known, and also a simulation model has to be created for better understanding the temperature swings corresponding to the powering scenario, which describes the application.[3,4]
In the discussion we will emphasize how to accurately calibrate the thermal model of the component in order to obtain correct temperature swing data.