Inscrição na biblioteca: Guest

ISSN Online: 2377-424X

ISBN Print: 1-56032-797-9

International Heat Transfer Conference 11
August, 23-28, 1998, Kyongju, Korea

THERMAL ANALYSIS OF PORTABLE ELECTRONIC EQUIPMENT

Get access (open in a dialog) DOI: 10.1615/IHTC11.40
pages 21-25

Resumo

This paper describes thermal analysis of portable electronic equipment. A numerical analysis was carried out on the basis of thermal conduction treatment for the whole domain of a subnotebook personal computer (PC) with a cooling fan. In this work, numerical analysis based on finite volume method was employed to estimate the temperature distribution of the PC. To treat the airflow caused by the tan inside the enclosure, lump model was used in addition to the thermal conduction model. The numerical model includes Si chips, packages, printed wiring boards, enclosure, etc. Temperature rise of LSI packages obtained by the thermal analysis showed a good agreement with the measured values.