ISSN Online: 2377-424X
ISBN Print: 0-89116-559-2
International Heat Transfer Conference 8
THERMAL FIELD PREDICTION IN ELECTRONIC EQUIPMENT
Аннотация
A 3 step development program has been elaborated to create a new and accurate method for predicting air flow and temperature field in electronic switching systems. These three steps are presented here. First, a numerical method was developed to solve an adequate mathematical model. Second, single row experiments were used jointly with a simple model to establish friction factor and heat transfer correlations. Third, a switching entity mock-up was specially designed to permit detailed air flow and temperature measurements. Different geometrical configurations and thermal power dissipations were experimented to validate the computer code.