Recent advances in additive manufacturing technologies have significantly expanded the design space for emerging electronics thermal management applications, requiring addressing both large background heat fluxes, as well as localized hot spots. Triply Periodic Minimal Surfaces (TPMS), with their mathematically controllable topologies, have found growing attention in steady state and transient applications, due to their superior heat transport ability, high strength-weight ratio, and outstanding thermal storage characteristics. From the geometrical perspective, TPMS porous structures are three dimensionally periodic implicit surfaces with a locally minimized area between given boundaries. Such topologies can create two distinct domains that intertwine without intersecting, resulting in smooth curvatures with no edges or corners. TPMS geometries can be modeled conveniently utilizing algorithmic modeling techniques. The recent unit-cell level characterizations of TPMS geometries have shown enhanced cooling performance with relatively high comprehensive (j/f) and volumetric heat transfer coefficients (hv). In this study, we examine a hybrid cold plate design combining micro pin fins with Schoen-G (Gyroid) TPMS architecture to strategically improve the cooling performance in hot spot regions, while reducing pressure drop penalty. To illustrate the thermal and hydraulic performance of the proposed design, heat removal and spreading behaviors of hybrid coolers are compared against traditional cooling surfaces with only micro-pin fins. A number of multi-functional cold plate configurations are designed for a given feature size of 350 and 600 µm, and thermal analysis is conducted with heat transfer area correction. Steady state three-dimensional computational fluid dynamics and heat transfer modeling is used to predict the complex flow and heat transfer responses in regions near the high heat flux semiconductor devices. Average Nusselt number (Nu), temperature profile, temperature uniformity (θ) was evaluated at different Reynolds numbers (Re) and pumping power conditions (W_pump) when the coolers with multiple heat sources were subjected to 1 kW/cm². The results show that the best performer hybrid cooler (Configuration 3) improved Nusselt number (Nu) and temperature uniformity (θ) by 13.7% and 19.4%, respectively, compared to the micro pin fin-based baseline cooler under the pumping power of 0.1 W. The thermohydraulic performance comparison of all configurations highlights the significance of a well-balanced design of hybrid coolers to avoid oversizing and unnecessary design complexity.