Efficient high-heat dissipation is vital in many applications, particularly in the electronics/power electronics industry. Air-based cooling systems can no longer adequately cool cutting-edge electronics. Hence, droplet and spray impingement are gaining increased attention as methods for high heat flux removal. Single droplet impingement analysis can provide fundamental insights into multiple droplets and spray studies. This paper documents a study on the cooling performance of a water droplet impinging on micro-sized pillars at a constant Weber number. Surfaces consisting of flat silicon, flat silicon with a titanium thin film, and different structured surfaces with surface area enhancement ratios (AEs) were investigated from AE = 1 to 7, using 30 µm tall square pillars with widths and pillar gaps ranging from 10 to 50 µm. A high-speed camera was used to record the droplet−surface interaction. A hotplate heated the samples to the desired temperature of 95°C, and a fast thermocouple measured the temperature trace beneath the surface during the droplet's contact with the surface. A hybrid inverse solution using the classical integral transform technique was used to calculate the heat transfer through the droplet contact area. Flat titanium and silicon surfaces achieved the highest maximum spreading diameters, but 10 × 50 micropillars yielded the highest cooling rate (°C/s). The preliminary results showed that heat transfer decreased for the structured surfaces, not considering surface AE despite the larger expected droplet−surface contact area. However, the 5 × 5 micropillar structured surface showed a 69% increase in the peak heat transfer rate compared with the flat silicon surface, when considering its AE. This research contributes to knowledge on electronic component cooling, showing potential improvements with simple additions in the fabrication process. Further examination is needed however, in the two phase-regime and with flow visualisation within structures.