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International Heat Transfer Conference 16

ISSN: 2377-424X (online)
ISSN: 2377-4371 (flashdrive)

LOW MELTING POINT METAL ENABLED PCM HEAT SINK AGAINST HIGH HEAT FLUX THERMAL SHOCK

Xiao-Hu Yang
Beijing Key Lab of Cryo-Biomedical Engineering and Key Lab of Cryogenics, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100190, China; School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, China

Sen Chen
Beijing Key Lab of Cryo-Biomedical Engineering and Key Lab of Cryogenics, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing 100190, China; School of Future Technology, University of Chinese Academy of Sciences, Beijing 100049, China

Xin-Lin Xu
Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, 29 Zhong Guan Cun East Rd. Haidian District, Beijing 100190, China; University of Chinese Academy of Sciences, 19 Yu Quan Rd. Shijingshan District, Beijing 100049, China

Jing Liu
Beijing Key Lab of Cryo-Biomedical Engineering and Key Lab of Cryogenics, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing, 100190, China; School of Future Technology, University of Chinese Academy of Sciences, Beijing, 100039, China; Department of Biomedical Engineering, School of Medicine, Tsinghua University, Beijing, 100084, China

DOI: 10.1615/IHTC16.ctm.022097
pages 3889-3894


KEY WORDS: Electronic equipment cooling, Thermal management, Heat transfer enhancement, Low melting point metal, Phase change material

Abstract

In this paper, an internally finned PCM thermal buffering module based on a low melting point metal, gallium, is developed and numerically investigated. Thermal responses of the module under high thermal shock conditions (e.g. 100 W, 25 W/cm2) are studied, in comparison with that of a conventional paraffin PCM. The main parameters characterizing the module, including thermal resistance and temperature rise rate during melting, are evaluated, and corresponding correlations are provided for guiding practical thermal design. Periodic thermal performance of the module under given convection cooling condition is investigated and compared with the case without PCM. The developed low melting point metal based PCM module shows excellent thermal control performance in coping with high heat flux thermal shocks, which is very difficult to handle by conventional organic PCMs.

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