The Power surges occurring in electronic devices for a short duration of time (can last up to a maximum of 100 s) cause a sharp rise in the temperature of the electronic chip. They can result in a catastrophic failure of thermally sensitive chip components. In the present study, a double-layered hybrid minichannel heat sink with the top layer filled with phase change material (n-eicosane) and the bottom layer having fluid (de-ionized water) flow has been proposed for effective thermal regulation during surge heat loading. The effect of the presence of PCM in the top layer and various flow conditions in the bottom layer for different surge durations and surge intervals are investigated numerically. The governing equations with the respective boundary conditions are solved using ANSYS FLUENT 2021 R1. From the present study, it is observed that the presence of PCM in the second layer effectively regulates the temperature rise for all the heat loads having different surge durations and surge intervals. The maximum peak temperature of the chip surface can be reduced up to 3.8 K using PCM in the top layer for a typical surge heat flux (62500 W/m²) having surge duration 30 s and surge interval 150 s appear during a nominal heat flux of 18750 W/m²