A cooling method using boiling heat transfer is highly attractive as a thermal management system of high heat flux applications. Even surface modification methods to enhance boiling heat transfer performance for thermal management were investigated over two-decade, but heat transfer enhancement is still limited depending on the surface materials. This study developed a universal, easy heat transfer enhancement method using micro-thick copper foams. The boiling heat transfer performances through micro-thick copper foams with various thicknesses and pore densities are confirmed in the saturated water at atmospheric pressure. A surface modification surface with 6.25 cm² of the area has a heater with 1 cm² of the area and is heated through a resistance heating element. The experimental results show that the boiling heat transfer performance increased as the thickness of the copper foam decreased regardless of the working fluid. However, as the thickness of the metal foam becomes thinner, the heat transfer performance becomes unstable and reaches the local dry-out. Surface modification with copper foam having a thickness of 100 µm and a pore density of 100 PPI has a wall superheat of 12.7K at a heat flux of 200 W/cm². Also, the critical heat flux is observed to be 275 W/cm². This critical heat flux is high compared to other surface modification methods, and in particular, CHF was not observed for thicknesses greater than 200 µm. Therefore, it was confirmed that the micro-thick copper foam is an effective method for enhancing the boiling heat transfer performance.