ISSN Online: 2377-424X
ISBN Print: 0-85295-345-3
International Heat Transfer Conference 10
HEAT TRANSFER IN ELECTRONIC PACKAGING
Résumé
The important contact and convection thermal resistances
which occur at the numerous interfaces and
at the air cooled interfaces in association with microelectronic packaging are considered in this paper. The
contact, gap and joint conductance models based on
plastic deformation of the contacting asperities are reviewed, and the most recent modifications to the relative
contact pressure are presented. The contact conductance
model is compared againt data obtained for
four different metals, and a wide range of effective surface
roughness and surface slope. With the exception
of some light load data, the model predictions and the
data are in very good agreement.
A recently proposed simple cuboid model is applied to the problem of predicting the heat transfer rates from rectangular heat sinks. The agreement between the model and some data is shown to be in excellent agreement over a range of Rayleigh number corresponding to boundary layer flow over the active heat sink surface.
A recently proposed simple cuboid model is applied to the problem of predicting the heat transfer rates from rectangular heat sinks. The agreement between the model and some data is shown to be in excellent agreement over a range of Rayleigh number corresponding to boundary layer flow over the active heat sink surface.