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ISBN: 978-1-56700-537-0

ISBN Online: 978-1-56700-538-7

ISSN Online: 2377-424X

International Heat Transfer Conference 17
August, 14-18, 2023, Cape Town, South Africa

THERMAL PERFORMANCE ASSESSMENT OF A COMPACT FLAT THERMOSYPHON WITH WETTABILITY MODIFICATIONS

Get access (open in a dialog) DOI: 10.1615/IHTC17.200-50
10 pages

Resumo

In the present work, the thermal performance of a horizontal CFT is investigated experimentally for different wettabilities of evaporator and condenser surfaces. The CFT of size 7.2 × 2.4 × 1.5 cm3 is made up of copper. A heat source of area 2.4 × 2.4 cm2 is centrally placed on the evaporator plate, and water is used as working fluid at a 50% filling ratio. The bare copper surface is hydrophilic with a contact angle of 78°. The wettability of the bare copper surface is changed to the superhydrophilic nature of contact angle less than 5° through oxidation with sodium hydroxide. The wettability of the bare copper surface is changed to the superhydrophobic nature of contact angle 155° through silanization with a fluoro-alkyl silane. Five different configurations of evaporator and condenser surface wettabilities are studied. The total resistance of CFT with the superhydrophobic condenser is lower than the bare condenser by 43.77 - 50.65 %. The improvement in the thermal performance with the superhydrophobic condenser is due to the dropwise condensation and faster condensate return. The total resistance of CFT with the as-prepared superhydrophilic evaporator is higher than the bare evaporator by 28.76 - 46.01 %. The deterioration in the thermal performance with the as-prepared superhydrophilic evaporator is due to the large thermal resistance from copper oxide coating that increased superheat and delayed bubble nucleation. Further studies on superhydrophilic evaporator surfaces prepared with coatings of very low thickness and high thermal conductivity are recommended as they can improve boiling performance. The total resistance of CFT with the superhydrophobic evaporator is higher than the bare evaporator by 48.37 - 133.16 %. The deterioration in the thermal performance with the superhydrophobic evaporator is due to the film boiling and the formation of an insulating vapor film. The CFT with a superhydrophobic evaporator and superhydrophobic condenser is the worst-performing configuration. The condensation enhancement from the superhydrophobic condenser is insignificant compared to the boiling deterioration from the superhydrophobic evaporator. The CFT with bare or hydrophilic evaporator performs better than the asprepared superhydrophilic and superhydrophobic evaporators. The CFT with bare or hydrophilic evaporator and superhydrophobic condenser is the best-performing configuration.