In previous studies, we introduced the concept of a compact heat sink that combines an evaporator and an expansion device into a single unit for high heat flux applications. As the high-pressure subcooled liquid refrigerant expands in single or multiple orifices, sprays or free liquid jets are formed (depending on the orifice characteristics) which cool the heated surface by convective boiling and evaporation of the liquid film. Numerous applications can be sought involving the compact heat sink in vapor compression cooling systems (i.e., cooling of power electronics, batteries etc.), for they combine the low thermal resistance of jets and sprays with below-ambient evaporating temperatures. By the same token, microchannel evaporators can be combined with compact compressors to produce an effective alternative to the removal of high heat fluxes. With this in mind, the present paper compares the three cooling schemes (sprays, microchannels and impinging jets) in the same cooling system at identical operating conditions. The analysis is based on thermodynamic performance metrics and steady-state heat transfer parameters associated with the cooling schemes. The spray cooling scheme sustained the largest imposed thermal load of 235 W (heat flux of 36.9 W/cm²), maintaining the heated surface temperature below37.6 °C. On the other hand, the microchannel cooling scheme presented larger heat transfer coefficients for applied heat load up to 75 W (heat flux of 16.7 W/cm²), which rapidly degraded with the applied heat load increase as a result of a surface temperature sharp rise and large temperature gradient along the flow direction.