ISSN Online: 2377-424X
ISBN CD: 1-56700-226-9
ISBN Online: 1-56700-225-0
International Heat Transfer Conference 13
THERMAL CONDUCTANCE OF Au-OCTANEDITHIOL-GaAs JUNCTIONS
Abstract
The thermal conductance of Au-octanedithiol-GaAs molecular junctions fabricated by a rigid stamp-rigid substrate version of nanotransfer printing was measured. This process requires external pressure to promote contact at the gold-octanedithiol interface during the spontaneous formation of permanent Au-S bonds. Correspondingly, the interfacial thermal conductance was measured as a function of fabrication pressure from 60−160 MPa. Measurements using the 3ω technique indicate that regardless of the applied fabrication pressure, the thermal conductance of the Au-octanedithiol-GaAs junction is 24 ± 4 MW/m2·K. Scotch-tape adhesion tests on the junction indicate the presence of permanent Au-S bonds and that the junction is mechanically dominated by bridging octanedithiol molecules.